LAPIS plans to provide high performance, compact and multi-functional products by combining power device/ SOS/LSI/MEMS technology and WL-CSP technology.
Power device＋WL-CSP
Thick Cu
- Lower thermal resistance and improving parasitic inductance by thick Cu
LSI(SOS)＋WL-CSP
Integrated passive component and LSI (SOS) in WL-CSP
- Reduction number of external parts in customer
- Thin package with passive components such as capacitor and inductor
- Reduction of power loss by using insulating sapphire substrate
for LSI without eddy current from inductor
LSI/MEMS＋WL-CSP
3D package of LSI/MEMS and WL-CSP
- Multi-functional product with smaller footprint by implementation
of MEMS sensor and control LSI
- Has capability to process LSI, MEMS and WL-CSP continuously
in LAPIS Semiconductor Miyazaki plant