Overview

More Value-Added Application Technology
LAPIS Semiconductor's LSI Package Technology

LAPIS Semiconductor's LSI Package Technology
The objectives of the existing LSI package technology are to protect the main body of LSIs from external environment and to mount LSIs on boards.
Currently, high-value addition is requested to the package itself for effective mounting as a result of the expansion of the application fields of LSI products and diversified package materials, sizes, and shapes.
Therefore, in the LSI development, package technology has been paid attention to as a strategically important technology as well as design technology and process technology.
LAPIS Semiconductor contributes to customers with a wide array of package lineup and reliable technology based on the past performance which has been achieved by our active efforts in development of the package technology.

LSI Package Roadmap

LAPIS Semiconductor's LSI Package Roadmap

LSI Package Line Up

  Package Type Type Pin Count More information

SOP

Surface mount

8

Package Size

SSOP

Surface mount

16、20、30、32、60、64

Package Size

VSSOP

Surface mount

8

Package Size

TSOP
(TypeⅠ)

Surface mount

28

Package Size

TSOP
(TypeⅡ)

Surface mount

50、54

Package Size

QFP

Surface mount

44、56、64、80、100

Package Size

LQFP

Surface mount

32、144

Package Size

TQFP

Surface mount

32、44、48、52、64、80、100、120、128

Package Size

VQFN

Surface mount

28、48

Package Size

WQFN

Surface mount

12、16、24、28、32、36、40、64

Size

C-QFN
(Ceramic QFN)

Surface Mount Type
SpecialPackage (Examples)

24

Size

WSON

Surface mount

10

Package Size

TFBGA

Surface mount

25、54、81、96、144

Package Size

WL-CSP

Surface mount

20、34、48、67

Package Size / Technical Information

COF
(Chip On Film)

SpecialPackage (Examples)

Package for LCD Drivers

Technical Information