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 >  LSI Package


LSI Package

パッケージ詳細

  • Line up

  • Overview

  Package Type Type Pin Count More information

SOP

Surface Mount Type

8. 16. 24. 44

Package Size

SSOP

Surface Mount Type

16. 20. 30. 32. 60. 70

Package Size

TSOP (TypeⅠ)

Surface Mount Type

28. 32. 48. 56

Package Size

TSOP (TypeⅡ)

Surface Mount Type

26/20. 26/24. 28. 44/40. 44. 50/44. 50. 54. 66. 70. 86

Package Size

QFP

Surface Mount Type

44. 56. 64. 80. 100. 128

Package Size

LQFP

Surface Mount Type

32. 144. 176

Package Size

TQFP

Surface Mount Type

44. 48. 52. 64. 80. 100. 120. 128

Package Size

SOJ

Surface Mount Type

26/20. 26/24. 28. 40. 42

*The dimensional drawing of
"SOJ" package is not indicated.
For details, contact to the sales (ROHM Co., Ltd.).

DIP

Surface Mount Type

8

Package Size

VQFN

Surface Mount Type

28. 32. 48

Package Size

WQFN

Surface Mount Type

12. 16. 20. 24. 28 32. 36. 40. 48. 52. 56. 64. 80

Package Size

BGA

Surface Mount Type

252

Package Size

LFBGA

Surface Mount Type

48. 84. 144. 324

Package Size

technical
Information

TFBGA

Surface Mount Type

60. 64. 84. 90. 144. 176. 208

Package Size

technical
Information

FLGA

Surface Mount Type

140

Package Size

technical
Information

WL-CSP

Surface Mount Type

Custom
Design

technical
Information

COF (Chip On Film)

SpecialPackage
(Examples)

Package for LCD Drivers

technical
Information

C-TQFN (Ceramic QFN)

SpecialPackage
(Examples)

12. 18

Package Size

More Value-Added Application Technology

- LAPIS Semiconductor's LSI Package Technology -

The objectives of the existing LSI package technology are to protect the main body of LSIs from external environment and to mount LSIs on boards.

Currently, high-value addition is requested to the package itself for effective mounting as a result of the expansion of the application fields of LSI products and diversified package materials, sizes, and shapes.

Therefore, in the LSI development, package technology has been paid attention to as a strategically important technology as well as design technology and process technology.

LAPIS Semiconductor contributes to customers with a wide array of package lineup and reliable technology based on the past performance which has been achieved by our active efforts in development of the package technology.

 

LSI Package Roadmap



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