Recommended Web browser of our site is Internet Explorer 9.0 and over or Google Chrome 33.0 and over.

Without the recommended environment, it may not be possible to use all features of our website.

If you use Windows XP ,we recommend use of Google Chrome.

Google Chrome is
available from here.

ホーム

 >  Foundry Service > WL-CSP Foundry Service


Development and Fabrication Sites,Quality Policy

WL-CSP Assembly and Testing Service

Service

Offer the downsizing and lightening package “WL-CSP”

The wafer level chip size package (WL - CSP) is the most suitable for downsizing and lightening for mobile system ,and contribute to High-performance and multi-function by Cu RDL technology and Plating technology (Cu・Ni・Au・SnAg).Also we will provide any foundry model for customer request.

  • We can deal with Cu RDL process、singulation process、Final Test、tape & reel packing consistently. Also we will deal with custom process and partial process. Please contact us.
  • Structure and Feature
  • Technology roadmap
  • New technology

What's WL-CSP

Wafer Level - Chip Size Package (WL-CSP) is The latest model package . WL-CSP has the structure of making Cu RDL、Molding 、terminal forming at wafer level without using lead frame ・gold wire. And it has the basic characteristics and reliability of WL-CSP is equal to conventional package, and realize downsizing and lightening. *µLAPIS™series

 

The advantage of WL-CSP

The advantage of WL-CSP

  • smallest, thinnest and lightest
  • Low cost
  • Saving resources (Ecology)
  • Reduction of material dead stock
  • Shortening TAT( turn around time)
  • It is possible to wire optionally
 

WL-CSP Structure and Feature

The lineup that can support the needs of Customers

    We are preparing several manufacturing method according to the product characteristic.

  • The product which requires the high reliability and is sensitive in a stress:
    Recommended type is 'Cu Pillar Type'
  • The product to which thinness is necessary: Recommended type is 'Cu Pillar-less Type'
  • The product to which fine pitch terminal is necessary:
    Recommended type is 'UBM type'.
 

Cu
Pillar Type
(Mold Type)

Cu
Pillar-less Type
(UBM Type)

structure

 
 

Wafer
specification

6inch
(JEIDA / Orientation Flat)

8inch
(SEMI /Notch )

6inch
(JEIDA / Orientation Flat)

8inch
(SEMI / Notch)

8inch
(Orientation Flat)

Terminal
pitch

0.3mm or more (print)

0.4mm or more (Ball)

0.15mm or more(print)

Terminal
material

Sn-3Ag-0.5Cu
(print / Ball)

Sn-3Ag-0.5Cu
(print)

insulation

PBO

PI / PI

(The upper layer/The lower layer)

RDL

Ti / Cu (Seed)

Cu (Plated RDL)

Ti / Cu (Seed)

Cu (Plated RDL)

Ni (UBM)

Option

Processing of the back side
(back side coating /Mirror polish),Multilayered RDL,The insulation layer formed by low temperature,Plating technology (SnAg,Au,Ni).

WL-CSP Process

We can deal with insulation layer,Cu RDL process、Si Grind,
Final Test,Dicing, tape&reel packing consistently.
reducing cost for customers.

 

Technology roadmap

 

Acceptable Wafer

 

Standard

Diameter

Thickness

6inch
(150mm)

JEIDA
/ Orientation Flat

150
±0.5mm

550,625
±25µmm

8inch
(200mm)

SEMI
/ Notch

200
±0.2mm

725
±20µmm

Thicker Cu RDL

Thicker Cu RDL can reduce Resistance and contribute to downsizing of module/system .

We will provide any foundry model for customer request.

  • Cu RDL Specifications (Standard)
    Cu/Ni/Au、Thickness : 15µm/3µm/0.2µm、L/S : 30µm/30µm
  • Cost saving
    We can deal with insulation layer,Cu RDL process、Si Grind ,Final Test,Dicing,tape&reel packing consistently.
  • Please contact us for Processing layout size .
 
 

Multilayered Cu RDL

We will contribute to downsizing and high functionality of module/system by Multilayered Cu RDL.

We will provide any foundry model for customer request.

  • Multilayered Cu RDL、2 layered RDL : available mass production
  • 3 layered RDL : available trial production We can deal with insulation layer,Cu RDL process、Si Grind ,Final Test,Dicing,tape&reel packing consistently.
  • Please contact us for Processing layout size .
 
 

Change screen size