Recommended Web browser of our site is Internet Explorer 9.0 and over or Google Chrome 33.0 and over.

Without the recommended environment, it may not be possible to use all features of our website.

If you use Windows XP ,we recommend use of Google Chrome.

Google Chrome is
available from here.

home

 >  Company > History


 

History


History

Includes the device achievement of Oki Electric Industry Co., Ltd. and OKI SEMICONDUCTOR CO., LTD. which are the predecessor of LAPIS Semiconductor Co., Ltd.

  • 1960
     ∼ 1980
  • 1980
     ∼ 2000
  • 2000
     ∼ 
Time Genre Article
1961 Facilities
Building No.1 completed
 

Products
Production of transistors
 

1962 Facilities
Building No.2 and No.3 completed
Hachiouji plant

Products
Production of millimeter wave
tubes and electronic computers

1965 Products
Production of reed relays /
Development of ICs started

1966 Products
Production of reed switches
 

1967 Products
Production of ICs

1968 Products
Development CMOS ICs started
 

1969 Facilities
Building No.4 completed
 

Products
Production of printed circuit boards
 

1975 Facilities
(Operations begun at Chichibu plant)

Chichibu plant


Products
Production of 4Kb DRAM
 

1977 Facilities
VLSI Laboratory No.1 completed
 

Products
Production of microprocessors
 

1979 Products
Production of microcomputers
 

Time Genre Article
1980 Facilities
Administration/Technology Center completed
 

1981 Facilities
(Operations begun at Miyazaki Oki Electric)
M1 Plant at Miyazaki Oki Electric

M1 Plant at Miyazaki Oki Electric


Products
Production of gate arrays and 64kb DRAMs
(3µm design rules used)
 

1982 Technologies
Technology transfer to National Semiconductor Inc.
 

1983 Facilities
VLSI Laboratory No.2 completed
 

Facilities
(M2 Plant completed at Miyazaki Oki Electric)
M2 Plant at Miyazaki Oki Electric

M2 Plant at Miyazaki Oki Electric


1984 Facilities
(Oki Micro Design Miyazaki established)
 

Products
Production of 256kb DRAMs
(2µm design rules used)
 

1985 Facilities
VLSI Laboratory No.3 completed
 

1987 Products
Production of 1Mb DRAMs
(1.2µm design rules used)
 

1988 Facilities
(Operations begun at Miyagi Oki Electric)
Miyazaki Oki Electric

Miyazaki Oki Electric


1989 Facilities
Production of 4Mb DRAMs
(0.8µm design rules used)
 

1990 Facilities
(Operation begun at Oregon Plant in U.S.)
Oregon Plant

Oregon Plant


Facilities
(Oki LSI Technology Kansai established)
 

1991 Facilities
(M3 Plant completed at Miyazaki Oki Electric)
 

1992 Facilities
(Operations begun at Thailand Plant)
Thailand Plant

Thailand Plant


Facilities
ULSI Laboratory No.1 completed
 

Products
Production of 16 Mb DRAMs (0.5µm design rules used)
16M DRAM

16M DRAM Pattern


1994 Products
256Mb DRAMs (0.25µm design rules used)
successfully developed
 

1995 Facilities
(S2 Plant completed at Miyazaki Oki Electric)
 

Products
Production of SSD cards
 

1996 Facilities
New Cafeteria Building completed (Building No.6)
 

1997 Facilities
New Administration/Technology Center completed
(Building No.7)
 

Products
Production of 64Mb DRAMs
(0.3µm design rules used)
 

Products
1Gb DRAMs (0.18µm design rules used)
successfully developed
 

1998 Products
Business based SPA started
 

Products
Surface-mount Optical Network Modules commercialized
 

Products
USB Control LSIs commercialized
 

Time Genre Article
2000 Products
Bluetooth System LSIs commercialized
 

Products
µPLAT developed
 

2002 Products
Production of LSIs using Fully
Depleted SOI-CMOS technology
 

2003 Products
Long-Wave Time Code Receiver based on
SOI-CMOS technology successfully developed,
an industry first
 

2004 Facilities
Semiconductor Bases in Shenzhen, Beijing
and Shanghai established
 

2005 Facilities
Semiconductor Business Group established
 

2007 Facilities
Silicon Microdevice Company established
 

2008 Facilities
OKI SEMICONDUCTOR CO.,LTD. established
 

2011 Facilities
The company name changed to
LAPIS Semiconductor Co., Ltd.

2013 Facilities
Moved the headquarter office at Shin-Yokohama.

 

Change screen size