History

Includes the device achievement of Oki Electric Industry Co., Ltd. and OKI SEMICONDUCTOR CO., LTD. which are the predecessor of LAPIS Semiconductor Co., Ltd.

:Facilities :Technologies/Products

1961	Building No.1 completed
	Production of transistors
1962	Building No.2 and No.3 completed
	Production of millimeter wave tubes and electronic computers
1965	Production of reed relays / Development of ICs started
1966	Production of reed switches
1967	Production of ICs
1968	Development CMOS ICs started
1969	Building No.4 completed
	Production of printed circuit boards
1975	(Operations begun at Chichibu plant)
	Production of 4Kb DRAM
1977	VLSI Laboratory No.1 completed
	Production of microprocessors
1979	Production of microcomputers
1980	Administration/Technology Center completed
1981	(Operations begun at Miyazaki Oki Electric)
	Production of gate arrays and 64kb DRAMs (3μm design rules used)
1982	Technology transfer to National Semiconductor Inc.
1983	VLSI Laboratory No.2 completed
	(M2 Plant completed at Miyazaki Oki Electric)
1984	(Oki Micro Design Miyazaki established)
	Production of 256kb DRAMs (2μm design rules used)
1985	VLSI Laboratory No.3 completed
1987	Production of 1Mb DRAMs (1.2μm design rules used)
1988	(Operations begun at Miyagi Oki Electric)
1989	Production of 4Mb DRAMs (0.8μm design rules used)
1990	(Operation begun at Oregon Plant in U.S.)
	(Oki LSI Technology Kansai established)
1991	(M3 Plant completed at Miyazaki Oki Electric)
1992	(Operations begun at Thailand Plant)
	ULSI Laboratory No.1 completed
	Production of 16 Mb DRAMs (0.5μm design rules used)
1994	256Mb DRAMs (0.25μm design rules used) successfully developed
1995	(S2 Plant completed at Miyazaki Oki Electric)
	Production of SSD cards
1996	New Cafeteria Building completed (Building No.6)
1997	New Administration/Technology Center completed (Building No.7)
	Production of 64Mb DRAMs (0.3μm design rules used)
	1Gb DRAMs (0.18μm design rules used) successfully developed
1998	Business based SPA started
	Surface-mount Optical Network Modules commercialized
	USB Control LSIs commercialized
2000	Bluetooth System LSIs commercialized
	μPLAT developed
2002	Production of LSIs using Fully Depleted SOI-CMOS technology
2003	Long-Wave Time Code Receiver based on SOI-CMOS technology successfully developed, an industry first
2004	Semiconductor Bases in Shenzhen, Beijing and Shanghai established
2005	Semiconductor Business Group established
2007	Silicon Microdevice Company established
2008	OKI SEMICONDUCTOR CO.,LTD. established
2011	The company name changed to LAPIS Semiconductor Co., Ltd.