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 >  LSI Package > Package more information WL-CSP


Package more information

WL-CSP

Overview

The wafer level CSP is ultra small and thin package developed to meet the requirements for high performance and downsizing typically by mobile equipment.

LAPIS Semiconductor provides strong support for customers' excellent product development by carrying out development based on the package technology cultivated for our own semiconductor devices and expanding foundry services for cutting-edge packages.

Features

 

Achieved ultra small packages ; 0% in mounting area and 10% in weight*1compared with conventional packages


*1 : Compared with LAPIS Semiconductor's 100-pin TQFP

Comparison between

TQFP and WCSPQFP/WCSP

Package
Size

(mm2)

Mounting
Area

(mm2)

Pin
Pitch

(mm)

Weight

(g)

14
×
14
256 0.5 0.26
5
×
5
25 0.5 0.03
 

Ultra Thin Type


  • Achieved 0.3mm thickness (typ.) for LGA. 0.4mm thickness (typ.) is also possible.0.2mm typ.
 

Ease of Handling


  • The plastic sealing on the device surface enables installation with batch reflow equipment in the same way as for existing packages.
  • Excellent reflow resistance ( JEDEC level 1 ) is achieved with material/process technologies.
 

Electrical Characteristics


  • The control of wiring width and wiring length enables achievement of excellent electrical characteristics.

Applications

Semiconductor devices for compact and light-weight equipment such as mobile phones, smart phones, digital camera.

Reliability Evaluation Results for Reference

High-temperature operation test (Ta : 125°C、VDD : 3.6V) 1000H Pass
High-temperature storage test (Ta : 150°C) 1000H Pass
High-temperature high-humidity bias test (Ta : 85°C、RH:85%、VDD:3.6V) 1000H Pass
Vapor unsaturation pressure test (Ta : 121°C、RH : 85%) 300H Pass
Temperature cycle test (-65°C to RT to 150°C) 500cyc. Pass

Specifications

Parameter Specifications
Wafer diameter 6 in., 8 in.
Pin material Eutectic , Pb-free
Pin shape LGA、BGA
Pin pitch LGA:0.3mm、BGA:0.4mm

Support

For customers to accelerate development and achieve volume production target, LAPIS Semiconductor provides strong supports:

  • Quick response through direct access to our key persons for individual items.
  • Support for heat resistance analysis and electrical characteristics analysis

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