*A typical outline drawing of each package is shown.

*These package size are an example. For details, please inquire

[WL-CSP] LSI Package Size

WCSP

Overview

World's smallest ultra-compact package

Lapis Semiconductor WCSP Package Technology
The conventional LSI package was a technology for protecting the LSI body from the outside and mounting it on a board.
Wafer-level CSP is the world's smallest ultra-small package that supports high performance and miniaturization represented by mobile devices.
LAPIS Semiconductor develops based on the packaging technology cultivated for its own semiconductor devices, develops the latest package foundry services, and strongly supports customers' excellent product development.

Features

Ultra-small and lightweight! 10% of mounting area and 10% of weight * 1 Revolutionary small package

* 1: Compared with conventional 100-pin TQFQ

QFP/WCSP

Comparison

PKG
Size

(mm2)

Mounting
area

(mm2)

Terminal
pitch

(mm)

weight

(g)

Comparison between TQFP100 and WCSP100 14
×
14
256 0.5 0.26
5
×
5
25 0.5 0.03

Ultra-thin

Realized 0.3mm typ. Thickness (0.2mm typ. Thickness is under development)

Easy handling

Since the device surface is sealed with resin, it can be mounted with a batch reflow device like a conventional package.

Excellent reflow resistance (JEDEC level 1) achieved by material / process technology.

Electrical characteristics

Excellent electrical characteristics can be realized by controlling wiring width, wiring length, multilayer wiring, etc.

Use

Semiconductor devices for small and lightweight devices such as mobile phones, smartphones, DSCs, cards, etc.
(Microcontroller, power supply IC, ASIC, sound source IC, RFIC, memory such as EEPROM, etc.)

Reference reliability evaluation results

High temperature operation test (Ta : 125°C、VDD : 3.6V) 1000H Pass
High temperature storage test (Ta : 150°C) 1000H Pass
High temperature and high humidity bias test (Ta : 85°C、RH : 85%、VDD : 3.6V) 1000H Pass
Japanese steam unsaturated pressurization test (Ta : 121°C、RH : 85%) 300H Pass
Temperature cycle test (-65°C to RT to 150°C) 500cyc. Pass

specification

Item specification
Wafer diameter 6 inches, 8 inches
Terminal material Eutectic, Pb-free(Sn-Ag-Cu)
Terminal shape LGA、BGA
Terminal pitch LGA:0.3mm、BGA:0.4mm

Support

To promote customer development and achieve mass production goals

  • Our quick response by direct access to key persons for each item
  • Thermal resistance analysis, electrical characteristics analysis support

We will support you strongly.