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Lead-free Products

Features and Appealing Points

  1. Lead (Pb) is not used inside the package nor at the pins.
  2. A reflow temperature of 260°C is permitted for the heat resistance temperature of surface-mount packages (SMD).
  3. For the pins, "Lead frame type: Sn-Bi" and "BGA type: Sn-Ag-Cu" are used.

Development Policy

  1. Implementation to all the products became possible in FY2003.
  2. Shipment of lead-free products can be made as soon as approval is obtained for each product.
  3. Lead-free products are differentiated from existing products.
  4. All products will be planned to integrate into lead free in future.
    But, when there was a request for lead-contained products, will be considered about the production.

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