*A typical outline drawing of each package is shown.
When designing and using the product, check the outline drawing and mounting specifications.

*These package size are an example. For details, please inquire

[WL-CSP] LSI Package Size

Construction

Package with semiconductor chip mounted on tape carrier by Tape Automated Bonding method

ラピスセミコンダクタのChipOnFilm パッケージ技術
Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB ( Tape Automated Bonding ) technique.
Material thickness has been reduced to allow supply of COF packages which support fine pitches.

Appealing Points

  • Patterning is applied to a tape substrate using thin copper foil, pin formation of 40µm and that of 35µm or less are possible for COF ( Chip On Film ) , respectively.
  • The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate.
  • COF can be freely fold-mounted except its plastic sealed section.